Lignin polymerization of epoxy compound -1

Early epoxy lignin had been reported in 1962, they are prepared by mixing 100 parts of lignin, 140 parts of phenol and three sulfuric acid, heated to 140 ~ 180 ℃, after a period of reaction, the residual phenol by vacuum distillation and distilled water removal, leaving lignin phenol resin, the lignin phenol resin, 32 chloro 1,2 – propylene oxide, methyl ethyl ketone mixture was heated while stirring and adding 40% sodium hydroxide. The next day, after filtration and distillation, separable from epoxy resin.

Nonaka YJ other industrial alkali lignin with an epoxy compound and a water-soluble polyoxyethylene diglycidyl ether (PEGDGE) and a curing agent reaction, the product had a novel resin, and found that as the lignin content increased, the change in the epoxy compound , the type of curing agent, to form an interpenetrating polymer network structure (IPNS).

Specifically the following experiment, a phenolic hydroxyl content of 2.7% (UV method) alkali lignin, dissolved in 1% sodium hydroxide solution at 60 ℃, the epoxy compound to the lignin solution with a polyoxyethylene diglycidyl ether blending, and addition of an aliphatic amine cross-linking agent, adding the amount of the epoxy crosslinked with 80% at room temperature after adding 1d, and then heated to 150 ℃, heat 3h, the cured film is a brown, transparent and has good The rigidity and strength of the product obtained as the glass transition temperature tunable large, so can be used as adhesives and insulation materials.

Lignin polymerization of epoxy compound -1

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